ELECTROLYTE FORMULATION FOR ELECTROCHEMICAL MECHANICAL PLANARIZATION
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United States of America Patent
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Issued Date -
Jun 19, 2008
app pub date -
Sep 28, 2007
filing date -
Dec 13, 2006
priority date (Note) -
Abandoned
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Abstract
Compositions and methods suitable for the electrochemical mechanical planarization of a conductive material layer on a semiconductor workpiece. Compositions contain a phosphonic acid based electrolyte, a corrosion inhibitor, a chelating agent, a pH adjusting agent, and a solvent as the remainder.
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