METHOD FOR MANUFACTURING MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Jun 19, 2008
app pub date -
Sep 26, 2007
filing date -
Dec 13, 2006
priority date (Note) -
Abandoned
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Abstract
The present inventions relates to a method for manufacturing a multilayer FPCB. The method includes the steps of providing three copper clad laminates and two binder layers, each of the copper clad laminates includes a dielectric layer and at least one patterned conductive layer formed on the dielectric layer; stacking the copper clad laminates and the binder layers alternately one on another; aligning the copper clad laminates and the binder layers; and compressing the copper clad laminates and the binder layers together thereby obtaining a multilayer flexible printed circuit board.
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