Thermoplastic Resin Composition
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United States of America Patent
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Issued Date -
Jun 12, 2008
app pub date -
Aug 29, 2005
filing date -
Aug 31, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A purpose of the invention is to provide a thermoplastic resin composition which enhances crystallization during molding, has high thermal deformation temperature, has high rigidity, induces less pealing on the molding surface, and gives excellent appearance, thus being preferably used as the facility parts of automobiles, and those of electric and electronics products. The (A) 100 parts by weight of a polyamide resin structured by the following monomers (1) and (2) is blended with (B) 5 to 100 parts by weight of a liquid crystalline polyester amide resin: (1) a diamine component containing an aliphatic diamine component unit having 4 to 12 carbon atoms arranged in straight chain and/or an aliphatic diamine component unit having 4 to 12 carbon atoms having side chain, and a derivative thereof; and (2) a dicarboxylic acid component containing 40 to 100% by mole of terephthalic acid component unit and 0 to 60% by mole of isophthalic acid component unit, and a derivative thereof.
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