Chemical composition for chemical mechanical planarization
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United States of America Patent
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Issued Date -
Jun 12, 2008
app pub date -
Dec 12, 2006
filing date -
Dec 12, 2006
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Abandoned
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Abstract
The chemical composition for a slurry for chemical mechanical planarization includes abrasive particles selected from the group consisting of SiO.sub.2, Al.sub.2O.sub.3, TiO.sub.2, and CeO.sub.2, and combinations thereof, and a silicate oligomer as a rate accelerator. The slurry may include an organic dispersion agent, and preferably has a has a pH in the range of about 4 to about 12.
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