Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
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United States of America Patent
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Issued Date -
Jun 5, 2008
app pub date -
May 15, 2007
filing date -
Mar 21, 2006
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Abandoned
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Abstract
One embodiment includes: a copper substrate; a catalyst on top of a single surface of the copper substrate; and a thermal interface material on top of the single surface of the copper substrate. The thermal interface material comprises: a layer of carbon nanotubes that contacts the catalyst, and a filler material located between the carbon nanotubes. The carbon nanotubes are oriented substantially perpendicular to the single surface of the copper substrate. The thermal interface material has: a bulk thermal resistance, a contact resistance between the thermal interface material and the copper substrate, and a contact resistance between the thermal interface material and a solid-state device. The summation of the bulk thermal resistance, the contact resistance between the thermal interface material and the copper substrate, and the contact resistance between the thermal interface material and the solid-state device has a value of 0.06 cm.sup.2K/W or less.
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