Double Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
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United States of America Patent
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Issued Date -
Jun 5, 2008
app pub date -
May 15, 2007
filing date -
Mar 21, 2006
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Abandoned
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Abstract
Carbon nanotube-based structures and methods for removing heat from solid-state devices are disclosed. In one embodiment, a copper substrate has thermal interface materials on top of front and back surfaces of the copper substrate. Each thermal interface material (TIM) comprises a layer of carbon nanotubes and a filler material located between the carbon nanotubes. The summation of the thermal resistance of the copper substrate, the bulk thermal resistance of each TIM, the contact resistance between each TIM and the copper substrate, the contact resistance between one TIM and a solid-state device, and the contact resistance between the other TIM and a heat conducting surface has a value of 0.06 cm.sup.2K/W or less.
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