VENTS WITH SIGNAL IMAGE FOR SIGNAL RETURN PATH
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Jan 3, 2008
filing date -
Jan 8, 2002
priority date (Note) -
Abandoned
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Abstract
A method for forming an electrical structure. A dielectric substrate having a metal signal line therein is provided. A first metal voltage plane is laminated to a first surface of the dielectric substrate. An opening in the first metal voltage plane is formed such that a first electrically conductive strip across the opening includes an image of a first portion of the metal signal line, wherein the image of the first portion of the metal signal line projects across the opening in the first metal voltage plane. A signal current is flowed through the metal signal line, wherein the signal current is an alternating current. A return current is flowed through the first electrically conductive strip, wherein the return current includes a portion of the signal current.
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