Metal Thin Film-Forming Method And Metal Thin Film
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 29, 2008
app pub date -
Dec 15, 2005
filing date -
Dec 20, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A metal thin film-forming method which comprises the step of firing metal nanoparticles each comprising a particle consisting of at least one metal selected from Ag, Au, Ni, Pd, Rh, Ru, and Pt or an alloy comprising at least two of these metals and an organic substance adhered to the periphery thereof as a dispersant, under a gas atmosphere containing water and/or an organic acid to thus form a metal thin film. This metal thin film possesses a low resistance value.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully