Hybrid clamshell blade system
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United States of America Patent
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Issued Date -
May 29, 2008
app pub date -
May 15, 2007
filing date -
May 15, 2006
priority date (Note) -
Abandoned
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Abstract
A hybrid clamshell system encapsulates two of the six sides of an electronic circuit board to provide a high heat density solution and environmental protection. The clamshell enclosures seal to both sides of the PCB and contain fluid shut-off couplings. A two-phase cooling system directs a coolant via a supply path located in the sidewall of the enclosure to one or more cooling modules and collects the coolant via a return path within the enclosure. With the addition of an inject/eject mechanism attached to the clamshell, the fully assembled blade can be 'fluid hot-swapped' in and out of the chassis with negligible loss of coolant. The interrelation of the clamshell module and it's implementation in an exemplary system are detailed herein.
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