SILICON CARRIER HAVING INCREASED FLEXIBILITY
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United States of America Patent
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app pub date -
Oct 31, 2007
filing date -
Dec 30, 2005
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Abandoned
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Abstract
An apparatus and method providing flexibility to a silicon chip carrier which, in at least one embodiment, comprises multiple chips and a silicon chip carrier having thinned regions between some adjacent chips, thus, allowing for increased flexibility and reduced package warpage.
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