Small footprint high power light emitting package with plurality of light emitting diode chips
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United States of America Patent
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Issued Date -
May 29, 2008
app pub date -
Sep 7, 2006
filing date -
Sep 7, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A light emitting package includes a support (12, 112, 212) defining a support surface (14). A first light emitting diode chip (20, 120, 220) is secured to the supporting surface and is configured to emit light having a first spectral distribution. A second light emitting diode chip (22, 122, 123, 222) is secured to the first light emitting diode chip. The second light emitting diode chip is configured to emit light having a second spectral distribution different from the first spectral distribution. Optionally, a third light emitting diode chip (223) is disposed on the second light emitting diode chip (222).
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