SUBSTRATE CONTACT FOR A MEMS DEVICE
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United States of America Patent
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Issued Date -
May 22, 2008
app pub date -
Nov 15, 2007
filing date -
Nov 17, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The substrate contact serves as a path to ground for the MEMS handle wafer layer and is formed during the fabrication process of the MEMS device. One advantage of the disclosed invention is that a robust, low-impedance path to ground is provided for the MEMS handle wafer layer, with minimal impact on the process of fabricating a MEMS device.
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