Film and chip packaging process using the same
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United States of America Patent
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Issued Date -
May 15, 2008
app pub date -
Nov 8, 2007
filing date -
Nov 9, 2006
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Abandoned
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Abstract
A film includes a removable base material, a resin layer and a plurality of arc elastomers. The resin layer is a partially-cured resin which is in a half-melting state with viscosity at a temperature higher than a first temperature and in a solid state without viscosity at a temperature lower than a second temperature, and the resin layer in a solid state is adhered on the base material. The arc elastomers are disposed inside the resin layer. The present invention further provides a chip packaging process using the film.
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