Physisorption-based microcontact printing process capable of controlling film thickness
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United States of America Patent
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Issued Date -
May 15, 2008
app pub date -
Nov 14, 2006
filing date -
Nov 14, 2006
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Abstract
The disclosed is a physisorption-based microcontact printing process capable of controlling film thickness, primarily for creating patterns of thin film of organic molecules in micron and submicron scales, comprising an inking phase, a printing phase, and a demolding phase. The inking phase is combined with a thin-film growth approach, wherein the thin-film approach enables growth of an organic thin film with desired thickness onto a stamp, effectively controls the thickness of the pattern of the organic thin film transferred in the next printing phase. The demolding phase enables proper control of the temperature of and the printing pressure upon the transferred thin-film pattern to control the quality of surface roughness and residual internal stress in the printed pattern.
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