METHOD FOR ATTACHING INTEGRATED CIRCUIT COMPONENT TO A SUBSTRATE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 8, 2008
app pub date -
Nov 6, 2006
filing date -
Nov 6, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An integrated circuit component is attached to a substrate by dispensing a controlled amount of photo-activatable anisotropic conductive adhesive (ACA) at a desired location on the substrate, exposing the dispensed ACA to an electromagnetic radiation source to initiate a chemical reaction in the ACA, aligning the component with the substrate such that a bond pad on the component faces the dispensed ACA, bonding the component to the substrate under a low pressure loading, and heating the bonded component and substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully