THERMOPLASTIC FLUXING UNDERFILL METHOD
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United States of America Patent
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app pub date -
Jan 23, 2007
filing date -
Jun 11, 2003
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Abandoned
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Abstract
A flip chip having solder bumps and an underfill that is thermoplastic and fluxing, as well as methods for making such a device. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes.
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