APPARATUS AND METHOD FOR MEASURING CHUCK ATTACHMENT FORCE
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United States of America Patent
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Issued Date -
May 8, 2008
app pub date -
Oct 15, 2007
filing date -
Nov 3, 2006
priority date (Note) -
Abandoned
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Abstract
An apparatus and method for measuring a chuck attachment force are provided. The apparatus is capable of measuring loads applied to a measurement substrate, while the measurement substrate is detached from a chuck, and precisely calculating necessary force through a process of comparing and analyzing values of the measured loads. This may prevent errors in the application of attachment force during a semiconductor manufacturing process. In the semiconductor manufacturing process, when the substrate is detached from a chuck, the substrate may be prevented from being deformed or cracked.
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