Polyimide composite flexible board and its preparation
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 8, 2008
app pub date -
Feb 23, 2007
filing date -
Nov 3, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises mixing a polyamic acid resin having a CTE value after imidization of more than 20 ppm and a polyamic acid resin having a CTE value after imidization of less than 20 ppm in a certain ratio, and coating the mixture on a metal foil, then subjecting the polyamic acids to imidization, to obtain the polyimide composite flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability, and no warp without using an adhering agent.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully