Polyimide composite flexible board and its preparation
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United States of America Patent
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Issued Date -
May 8, 2008
app pub date -
Feb 23, 2007
filing date -
Nov 3, 2006
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids individually having a coefficient of thermal expansion (CTE) after imidization of more than 20 ppm and less than 20 ppm on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, to produce a polyimide composite flexible board, which is used as a printed circuit flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability, and no warp without using an adhering agent.
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