Polyketone Fiber Paper, Polyketone Fiber Paper Core Material For Printed Wiring Board, And Printed Wiring Board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20080105395A1
SERIAL NO

11795232

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An aliphatic polyketone fiber paper comprising aliphatic polyketone fibers and a polyketone fiber paper core material for a printed wiring board are provided. The polyketone fiber paper and the core material have high strength and modulus of elasticity; excellent dimensional stability, chemical resistance, heat resistance, adhesiveness and electrical insulation; and low dielectricity and water absorbance, and are thin, porous, and uniform. A printed wiring board prepared from the core material having a low dielectric constant, dimensional stability, electrical insulation, and properties of being uniformly bored by laser punching is also provided. The aliphatic polyketone fiber paper and the core material for a printed wiring board comprises 1 to 100% by mass of aliphatic polyketone fibers which comprise the repeating unit of the below-mentioned formula (1), the fibers having an average fiber length of 0.5 to 10 mm, an average fiber diameter of 0.1 to 20 .mu.m, a thickness of 5 to 200 .mu.m, a void ratio of 30 to 90%, and a strength per unit mass of 100 MN/kg or more. Also provided is a single layer or multilayer printed wiring board which comprises a core material impregnated or coated with a polymer resin, a low dielectric polymer resin, or a polyphenylene ether-based epoxy resin. --CH.sub.2--CH.sub.2--CO-- (1)

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI CHEMICALS CORPORATIONTOKYO 100-8440

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Higuchi, Masao Tokyo, JP 47 346
Matsushita, Fumio Tokyo, JP 19 325
Shiratori, Naoyuki Tokyo, JP 3 43

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