SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR APPARATUS
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United States of America Patent
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N/A
Issued Date -
May 1, 2008
app pub date -
Oct 31, 2007
filing date -
Nov 1, 2006
priority date (Note) -
Abandoned
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Abstract
Provided is a semiconductor package manufacturing method. The method comprises forming a metal circuit pattern on a substrate; connecting an integrated circuit unit to the metal circuit pattern; forming a resin on the substrate, the metal circuit pattern and the integrated circuit unit; and removing the substrate.
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