Method and System for Wafer Temperature Control
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United States of America Patent
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Issued Date -
Apr 24, 2008
app pub date -
Oct 13, 2005
filing date -
Oct 14, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Systems and methods for controlling the temperature of a wafer are disclosed. These systems and methods may employ a back side wafer pressure control system (BSWPC) that includes subsystems and a controller operable in tandem to control the temperature of wafers in one or more process chambers. The subsystems may include mechanical components for controlling a flow of gas to the backside of a wafer while the controller may be utilized to control these mechanical components in order to control wafer temperature in a process chamber. Furthermore, embodiments of these systems and methods may also use a chiller in combination with the controller to provide both coarse and fine temperature control.
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