Method For Welding Wafer Sheets And Product So Obtained
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United States of America Patent
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Issued Date -
Apr 24, 2008
app pub date -
Oct 13, 2005
filing date -
Oct 18, 2004
priority date (Note) -
Abandoned
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Abstract
Method for welding wafer sheets and product so obtained A method for welding wafer sheet parts along reciprocal mat-ing surfaces, in which the parts are welded to each other by the moistening of the mating surfaces and adhesion by contact of said surfaces. Moistening is preferably carried out using water alone nebulised onto the mating surfaces. The method is particularly applicable to industrial production of wafer sheet shells, formed by mating two half-shells together rim to rim.
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