DIGITAL CAMERA MODULE PACKAGE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Apr 24, 2008
app pub date -
Dec 28, 2006
filing date -
Oct 20, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A digital camera module package (200) includes a base (20), an image sensor chip package (21) and a lens module (22). The image sensor chip package is mounted on the base. The lens module includes a cavity (257). The cavity fittingly receives the image sensor chip package, and presses against a circumferential wall of the image sensor chip package. The digital cameral module package may precisely align the image sensor chip package with the lens module.
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