Cooled Integrated Circuit
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United States of America Patent
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app pub date -
Jul 20, 2004
filing date -
Jul 20, 2004
priority date (Note) -
Abandoned
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Abstract
The invention relates to an integrated circuit (1) having a plurality of substrate layers (2), active and/or passive components (3) embedded in the substrate layers (2), high-frequency lines conducted to the components (3) through the substrate layers (2), and cooling channels (6) for the dissipation of heat. The inventive circuit is characterized in that the cooling channels (6) are configured as high-frequency lines.
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