High Power Light Emitting Diode Package
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United States of America Patent
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N/A
Issued Date -
Apr 17, 2008
app pub date -
Mar 23, 2007
filing date -
Oct 11, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A high power light emitting diode ('LED') package is disclosed. The high power LED package includes a housing made of an insulating material and having a cavity in its central portion; a lead frame made of a conductive material, including an inner lead exposed by the cavity of the housing and an outer lead extending outside the housing; a heat sink above which the inner lead is placed and having a portion exposed by the cavity of the housing; an LED chip mounted on the exposed portion of the heat sink and electrically connected to the inner lead; a lens portion coupled to the housing to cover the cavity of the housing; and an insulating adhesive sheet interposed between the inner lead and the heat sink for electrically insulating and thermally coupling the inner lead and the heat sink.
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