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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
BASIN WATER INC	9302 PITTSBURGH AVENUE SUITE 210 RANCHO CUCAMONGA CA 91730

International Classification(s)

• B01J:CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, CO....
• C02F:TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE....

• 2007 Application Filing Year
• B01J Class
• 1802 Applications Filed
• 847 Patents Issued To-Date
• 47.01 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Jensen, Peter L	San Diego, CA	12	67
# of filed Patents : 12 Total Citations : 67
Ziol, Dan	Pasadena, CA	9	53
# of filed Patents : 9 Total Citations : 53

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Patent Citation Ranking

• 2 Citation Count
• B01J Class

• 5.92 % this patent is cited more than
• 17 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2018/0033,745

SEMICONDUCTOR DEVICE HAVING A DUAL MATERIAL REDISTRIBUTION LINE AND METHOD OF FORMING THE SAME

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Abstract

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A semiconductor device includes a first passivation layer over an interconnect structure. The semiconductor device further includes a first redistribution line (RDL) via extending through an opening in the first passivation layer to electrically connect to the interconnect structure. The first RDL via includes a first conductive material. The semiconductor device further includes an RDL over the first passivation layer and electrically connected to the first RDL via. The RDL comprises a second conductive material different from the first conductive material. The RDL extends beyond the first RDL via in a direction parallel to a top surface of the first passivation layer.

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Description

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Claims

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