LUMINOUS SIGN WITH ENCAPSULATED LED CHIPS
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United States of America Patent
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Issued Date -
Apr 17, 2008
app pub date -
Sep 7, 2007
filing date -
Sep 7, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A luminous sign using encapsulated LED chips with a neon light effect, comprising: a light guide, the front shape of which is the shape of a character with a selected width and height; an illumination channel, the shape of which is matched the shape of the light guide, the illumination channel and the light guide integrated into one piece; at least one PCB, the shape of which is matched the shape of the illumination channel, being placed underneath the illumination channel; a plurality of LED chips being spacedly disposed as a linear or strip array on the PCB by chip bonding method; the light guide, the illumination channel and the PCB form a closed light cavity, encapsulated with encapsulant doped with diffusion diluent; the encapsulated light guide, illumination channel and PCB are mounted on a supporting frame to form a character shape.
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