Method for the dimensionally controlled bonding of surfaces
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United States of America Patent
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Issued Date -
Apr 10, 2008
app pub date -
May 11, 2006
filing date -
May 13, 2005
priority date (Note) -
Abandoned
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Abstract
This invention introduces an improved method for bonding two surfaces using silk-screen printing technology. The method according to the invention reduces possible occlusion of the screen, thus improving the print quality of the deposited cement film. This is accomplished by adding particles to the print medium. In addition, by selecting the size of the particles it is possible for these, serving as spacers during the bonding process, to define the thickness of the cement layer. An additional procedural step describes the controlled mutual approach of the bonding surfaces.
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