Wire Bump Material
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United States of America Patent
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N/A
Issued Date -
Mar 27, 2008
app pub date -
Sep 29, 2005
filing date -
Sep 30, 2004
priority date (Note) -
Abandoned
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Abstract
The present invention was held in order to resolve problems on above-mentioned conventional wire bumping material. This invention has the following purposes; (1) approximating Au--Ag alloy bumping balls to bond Al pads to ideal sphere shape (2) increasing assurance of Au--Ag alloy bump bonding to Al pads (3) shortening tail length of Au--Ag alloy bump (4) improving anti-Au consumption into solder (5) decreasing contamination of capillary tip by bump wire and hole around tip Means for resolution Au--Ag alloy for wire bumping comprising wherein Au, which purity is more than 99.99 mass %, comprising Au matrix and a particle of additive elements, consisting of 1 to 40 mass % Ag, which purity is more than 99.99 mass %.
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