MOVABLE ELECTRONIC FLAME-OFF DEVICE FOR A BONDING APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20080073408A1
SERIAL NO

11534268

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A bonding apparatus is provided that comprises a bonding tool for bonding wire onto an electronic device secured by a clamping device. The clamping device is locatable at a first position to clamp the electronic device during bonding and a second position at a raised height to release the electronic device for indexing. A flame-off torch is locatable adjacent to the bonding tool and is operative to produce sparks to melt a tip of the wire for bonding. An actuator is further provided that is operative to lower the flame-off torch close to the electronic device during bonding and to raise the flame-off torch away from the electronic device during indexing so as to provide a height clearance between the flame-off torch and the clamping device at its second position.

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Patent Owner(s)

Patent OwnerAddress
ASM TECHNOLOGY SINGAPORE PTE LTDSINGAPORE SHUN SHUN ROAD 2 NO 7 SINGAPORE CITY SINGAPORE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Chong Hao Singapore, SG 5 40
KWAN, Ka Shing Kenny Singapore, SG 28 153
OU, Gang Singapore, SG 12 76
SONG, Keng Yew James Singapore, SG 7 34

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