Controlled shape semiconductor layer by selective epitaxy under seed structure

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United States of America Patent

PATENT NO 7686886
APP PUB NO 20080072816A1
SERIAL NO

11535122

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Abstract

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A method for forming a structure of a desired cross-section on a substrate is provided. The method provides a seed structure comprising at least one support layer on the substrate. The support layer has a geometric shape related to the desired cross-section of the structure and is diffusive to a precursor constituent. The method further includes growing the structure by supplying at least one precursor constituent on the substrate. The desired cross-section of the structure is defined by the geometric shape of at least one support layer.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Karg, Siegfried F Adliswil, CH 40 762
Riel, Heike E Rueschlikon, CH 49 661
Riess, Walter H Thalwil, CH 17 329
Schmid, Heinz Waedenswil, CH 61 654

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