Micro-Molding Equipment and Micro-Molding Method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20080067704A1
SERIAL NO

11577214

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Abstract

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The micro-molding equipment contains a preform molding equipment 10 taking a single-cavity of a preform material 3 corresponding to a small precision optical component to be molded with a runnerless mold, and a precision compression molding equipment 40 for after molding the preform material 3 by primary compression molding in a vacuum state, cooling the preform material to a temperature near a glass transition point, and then re-softening a surface layer of the preform material and molding the same by secondary compression molding to transfer the small precision optical component thereto.

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Patent Owner(s)

Patent OwnerAddress
RIKENJAPAN
THE NEXSYS CORPORATIONHIROSE BUILDING 9F 3-17 KANDA NISHIKI-CHO CHIYODA-KU TOKYO 101-0054
ASTOM R&DWAKO MH BUILDING 3F 1-10-5 MARUYAMADAI WAKO-SHI SAITAMA 351-0112
IKEGAMI MOLD ENGINEERING CO LTD5-5-30 MINAMI KUKI-SHI SAITAMA 348
SAN SEIMITSU KAKO LAB LTD707-4 TOKOROGUKI KUKI-SHI SAITAMA 346-0034

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ando, Tomoaki Saitama, JP 16 36
Ikegami, Keizo Saitama, JP 1 3
Lin, Weimin Saitama, JP 3 30
Ohmori, Hitoshi Saitama, JP 51 531
Shirataki, Yukihiro Saitama, JP 1 3
Shoji, Takeya Saitama, JP 1 3
Takeyasu, Hatsuichi Tokyo, JP 4 19
Uehara, Yoshihiro Saitama, JP 6 60
Washio, Masao Saitama, JP 1 3

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