Cutting Machine and Method of Moving Cutting Head

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United States of America Patent

SERIAL NO

11596677

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In a thermal cutting machine such as plasma cutting machine or a laser cutting machine, control of the moving speed of a cutting head (24) is improved so as to increase throughput of the cutting machine with increase in cost restricted. Products are cut out one by one from a plate member (14) while a cutting head (24) is moved relative to the plate member (14) on a table (12). In this process, when the cutting head (24) is fast-forwarded without performing cutting to a position at which cutting of each product starts, the speed of movement in the direction (Y-axis direction) along a short side of the table (12) is controlled at a speed higher than that of the movement in the direction (X-axis direction) along a long side of the table. The pattern of a sequence of cutting out the products from the plate member (14) is a meandering pattern in which reciprocation in the Y-axis direction dominates and the movement in the X-direction is one time one way. Exhaust chambers are arranged in the X-axis direction in the table (12), and the exhaust chambers are driven as the cutting head (24) moves in the X-axis direction.

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Patent Owner(s)

Patent OwnerAddress
KOMATSU INDUSTRIES CORPORATION1-1 SHIN-MACHI ONO-MACHI KANAZAWA-SHI ISHIKAWA 920-0225

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ohnishi, Satoshi Ishikawa, JP 8 62
Yamaguchi, Yoshihiro Ishikawa, JP 312 4076

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