Flame retarding and thermosetting resin composition
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United States of America Patent
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Issued Date -
Mar 13, 2008
app pub date -
Aug 24, 2006
filing date -
Mar 17, 2006
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a flame-retarding thermosetting resin composition, which comprises at least one silicate-copolymerized composite as filler and can be used as mechanical, electrical and electronic parts, molded and/or packaging resin for semiconductor and so on, etc. By adding such silicate-copolymerized composite, the resin composition of the present invention has improved flam retardance and heat resistance and has an excellent moldability and reliance under circumstances without adding any other flame-retarding material.
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