LIGHT EMITTING DEVICE WITH HIGH HEAT-DISSIPATING CAPABILITY
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United States of America Patent
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Issued Date -
Mar 13, 2008
app pub date -
Sep 10, 2007
filing date -
Sep 13, 2006
priority date (Note) -
Abandoned
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Abstract
A light emitting device includes: a heat dissipating unit including a metallic first heat sink having a chip-mounting area, a thermally conductive bonding layer, and a metallic second heat sink overlapping and attached to the first heat sink through the bonding layer such that the bonding layer is sandwiched between the first and second heat sinks, the heat dissipating unit being formed with a light exit window that is aligned with the chip-mounting area and that extends through the second heat sink and the bonding layer so as to expose the chip-mounting area; a light emitting chip attached to the chip-mounting area of the first heat sink for emitting light through the light exit window; and a transparent enclosing material filling the light exit window to enclose the light emitting chip.
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