APPARATUS AND METHODS FOR CLEANING A WAFER EDGE
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United States of America Patent
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Issued Date -
Mar 13, 2008
app pub date -
Sep 8, 2006
filing date -
Sep 8, 2006
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Abandoned
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Abstract
Apparatus removes contaminants from edge areas of a wafer by spinning the wafer. Nozzles spray or jet fluid onto both the first and second sides of the wafer, near the edge of the wafer. Typically the spray or jet is at an acute angle to the wafer surface. Contaminants are removed and re-deposition of removed contaminants is reduced or avoided. The nozzle locations and angles may be varied to change the areas on the wafer cleaned by the sprays or jets.
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