WORKPIECE PROCESSING WITH PREHEAT
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United States of America Patent
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Issued Date -
Mar 13, 2008
app pub date -
Sep 11, 2006
filing date -
Sep 11, 2006
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Abandoned
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Abstract
A method for cleaning vias, trenches, or other features on a workpiece, such as a semiconductor wafer, includes pre-heating the wafer to a desired temperature. A heated processing or cleaning fluid is then applied to the workpiece. The workpiece may be heated to a temperature higher than the temperature of the processing fluid, to increase the chemical reaction efficiency between the processing fluid and the workpiece features. The workpiece may be heated before or after being loaded into a processing chamber.
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