METHOD OF FABRICATING METAL LINE BY WET PROCESS
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United States of America Patent
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Issued Date -
Mar 6, 2008
app pub date -
Nov 21, 2006
filing date -
Aug 31, 2006
priority date (Note) -
Abandoned
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Abstract
A method of fabricating of a metal line by a wet process is provided. A catalytic adhesive layer is formed on an insulating substrate. A fist metal layer is formed by an electoless plating process, and then, a second metal layer is formed by an electoless plating process or an electoplating process. The first and the second metal layers are patterned to form a metal line.
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