Resin Layer Forming Method And Apparatus For The Same

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United States of America Patent

APP PUB NO 20080057181A1
SERIAL NO

11575107

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Abstract

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With respect to a liquid material such as an adhesive supplied at an inside portion between substrates, or the liquid material supplied to the inside portion on a substrate, a step of extending by rotation at a high speed and a step of rotating at a low speed are repeatedly and alternately conducted, and radiation of light is continuously or intermittently moved in order to gradually semi-cure or cure the liquid material in a radial direction from inside to outside. Therefore, the thickness of a resin layer made from the liquid material is gradually fixed in a radial direction from inside to outside.

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Patent Owner(s)

Patent OwnerAddress
ORIGIN ELECTRIC COMPANY LIMITED18-1 TAKADA 1-CHOME TOSHIMA-KU TOKYO 171-8555

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kobayashi, Hideo Tokyo, JP 434 4833
Ozawa, Naoto Tokyo, JP 21 52
Suzuki, Takayuki Yachiyo-shi, JP 661 11733

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