High-power laser-diode package system
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United States of America Patent
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Issued Date -
Mar 6, 2008
app pub date -
Aug 31, 2006
filing date -
Aug 31, 2006
priority date (Note) -
Abandoned
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Abstract
A system includes a laser-diode bar comprising an emitting surface and a reflective surface opposing the emitting surface. The laser-diode bar includes a positive-side surface and a negative-side surface opposing the positive-side surface for conducting electrical energy through laser-diode bar. The system also includes a heat sink thermally coupled to the laser-diode bar. The heat sink is made of a material selected from the group consisting of Skeleton-cemented diamond and diamond-copper composite. The system also includes a heat spreader interposed between the heat sink and the laser-diode bar. The heat spreader includes a first surface thermally interfacing the positive-side surface of the laser-diode bar. The first surface is substantially smoother than a surface on the heat sink and includes an electrically conductive material for conducting the electrical energy into the laser-diode bar.
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