Electrostatic chuck, substrate processing apparatus having the same, and substrate processing method using the same
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United States of America Patent
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Issued Date -
Mar 6, 2008
app pub date -
Aug 24, 2007
filing date -
Aug 30, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An electrostatic chuck includes both a DC power supply and an AC power supply. DC power is supplied to an electrode of the chuck to generate an electrostatic holding force that holds a substrate on the chuck during substrate processing steps. When it is time to remove the substrate from the chuck, the DC power is cut off, and an AC power is applied to help eliminate any residual charge left on the chuck after the DC power has been cut off.
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