PCB Board For Hybrid Circuit Of An Image Sensor
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United States of America Patent
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Issued Date -
Mar 6, 2008
app pub date -
Aug 29, 2007
filing date -
Sep 1, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A printed circuit board (PCB) for deployment of a sensor chip of an optical head of an endoscope is described. The PCB comprises at least one layer defined by a front surface, a rear surface and a recess provided on said front surface. The recess has a depth dimension and the sensor chip has a thickness corresponding to said depth dimension of the recess. The sensor chip is receivable within the recess so as to be essentially flush with the front surface of the PCB. The PCB comprises at least one bonding pad located at a predetermined distance from the sensor chip and is electrically connectable with the sensor chip.
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