CHIP PACKAGE AND DIGITAL CAMERA MODULE USING SAME
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United States of America Patent
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N/A
Issued Date -
Mar 6, 2008
app pub date -
Dec 27, 2006
filing date -
Aug 23, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A digital camera module (200) includes a chip package (20) and a lens module (50) mounted to the chip package. The package includes a carrier (21), a chip (23), a plurality of wires (24), a supporting member (25), an adhesive (26), and a cover (28). The carrier has a top surface (211), and a plurality of top contacts (215) arranged on the top surface. The chip is mounted to the top surface of the carrier, and includes an active area (231) and a plurality of pads (233). The wires electrically respectively connect one of the pads to a corresponding top contact. The adhesive is applied to a peripheral circumference of the top surface of the chip. The cover is adhered to the adhesive, and closes the active area of the chip. The supporting member is disposed between the carrier and the cover to support the cover.
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