Soldering flux and solder paste composition
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United States of America Patent
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Issued Date -
Mar 6, 2008
app pub date -
Sep 5, 2007
filing date -
Sep 5, 2006
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Abandoned
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Abstract
A soldering flux contains a base resin and an activating agent. The soldering flux contains, as the activating agent, an oxygen-containing heterocyclic compound having at least one carboxyl group in a molecule. A solder paste composition contains the abovementioned soldering flux and the solder alloy powder. These enable exhibition of excellent wettability to lead-free metals and plating, irrespective of the type of the metals.
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