Process for making a bamboo filament slab floor by opposite directional hot pressing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Feb 16, 2010
Grant Date -
Mar 6, 2008
app pub date -
Jan 11, 2007
filing date -
Sep 1, 2006
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention relates to bamboo manufacturing field, in particular, to a process for making a bamboo filament slab floor by opposite directional hot pressing. Aiming to overcome the defects that, while compressing, the existing bamboo filament slab floor at normal temperature under cold pressing is easy to rebound and expand, has low strength and weak resistance to abrasion and is easy to mildew while using for a long time, the present invention adopts shredding bamboo sheet, sizing treatment, molding bamboo filament and etc. procedures, characterized in that, a secondary drying procedure should be inserted between said sizing treatment and bamboo filament molding procedure; said sizing treatment should be implemented by soak sizing bamboo filament; said compressing includes opposite directional hot pressing of positive pressing and side pressing. The present invention adopts specific manufacturing technology, thus the floor can avoid the occurrence of holes and gaps inside bamboo filament slab floor and discharge formaldehyde and has stable quality, and will be not prone to mildew and deform while using for a long time. It can be widely used and suitable for indoor and outdoor flooring and various boards used in decoration and furniture.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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WANG ZHENGFENG | Not Provided |
International Classification(s)

- 2007 Application Filing Year
- B27J Class
- 6 Applications Filed
- 3 Patents Issued To-Date
- 50 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Wang, Zhengfeng | B-201, Office Building, World Trade Center, No. 122 Shuguang Road | 5 | 11 |
# of filed Patents : 5 Total Citations : 11 |
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Patent Citation Ranking
- 1 Citation Count
- B27J Class
- 0 % this patent is cited more than
- 15 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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