Epoxy-containing poly(ester amides) and method of use
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United States of America Patent
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Issued Date -
Feb 28, 2008
app pub date -
Aug 16, 2007
filing date -
Aug 18, 2006
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Abandoned
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Abstract
The invention provides aliphatic epoxy-containing PEA polymer compositions with film-forming properties. The aliphatic epoxy di-acids used in the invention PEA compositions include non-toxic fatty aliphatic epoxy homologs. A second, C-protected L-lysine-based monomer can be introduced into the polymer to provide additional chain flexibility. The invention PEA polymer compositions are useful for delivery of bioactive agents when administered internally or used in the manufacture of implantable medical devices. Biodegradable hydrogels can be made using the invention epoxy-containing PEAs.
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