Accurate measurement of layer dimensions using XRF

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United States of America Patent

APP PUB NO 20080049895A1
SERIAL NO

11889337

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for inspection of a sample includes directing an excitation beam to impinge on an area of a planar sample that includes a feature having sidewalls perpendicular to a plane of the sample, the sidewalls having a thin film thereon. An intensity of X-ray fluorescence (XRF) emitted from the sample responsively to the excitation beam is measured, and a thickness of the thin film on the sidewalls is assessed based on the intensity. In another method, the width of recesses in a surface layer of a sample and the thickness of a material deposited in the recesses after polishing are assessed using XRF.

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Patent Owner(s)

Patent OwnerAddress
JORDAN VALLEY SEMICONDUCTORS LTDP O BOX 103 MIGDAL HAEMEK 23100

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Agnihotri, Dileep Round Rock, TX 11 255
O'Dell, Jeremy Manor, TX 2 19

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