Heat pump cycle device
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United States of America Patent
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N/A
Issued Date -
Feb 21, 2008
app pub date -
Apr 5, 2007
filing date -
Apr 7, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat pump cycle device includes a compressor for drawing and compressing refrigerant, a first high-pressure heat exchanger located for heating a first fluid circulating in a first fluid circuit using high-pressure refrigerant discharged from the compressor, a second high-pressure heat exchanger for heating a second fluid circulating in a second fluid circuit using the high-pressure refrigerant flowing out of the first high-pressure heat exchanger, a first heating heat exchanger located to heat a third fluid using the first fluid, a second heating heat exchanger located to heat the third fluid using the second fluid, a decompression unit located to decompress the high-pressure refrigerant flowing out of the second high-pressure heat exchanger, and a low-pressure heat exchanger for evaporating low-pressure refrigerant decompressed by the decompression unit. Because the first and second high-pressure heat exchangers are located, cycle efficiency can be improved.
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