IC Package, IC Socket, and IC Socket Assembly
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United States of America Patent
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app pub date -
Oct 9, 2007
filing date -
Mar 10, 2005
priority date (Note) -
Abandoned
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Abstract
An IC socket assembly includes an IC socket, constituted by: a plurality of electrical contacts; an IC package mounting surface; an insulative socket housing for holding the plurality of electrical contacts at the IC package mounting surface; and an urging member for urging an IC package, which is mounted on the IC package mounting surface, toward the plurality of electrical contacts so as to establish electrical connections therewith; and the IC package. The IC package has a frame member provided about the periphery of a main body thereof.
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